Notice on holding "Component Defectum Analysis Technology and Practice Case" Application analysis Senior Seminar
Quintum Institutum Electronics, Ministerium Industry ac Information Technologiae
Incepta et instituta:
Ut fabrum et technicae adiuvent, difficultates technicas et solutiones componentium analysis defectivae ac PCB&PCBA brevissimo tempore analysin defectum suppeditant;Auxilium personas pertinentes in incepto ad systematice intelligendos et ad meliorem technicam ordinem pertinentes, ad validitatem et fidem testium eventuum invigilandum.Quintum Institutum Electronics Ministerii Industry ac Information Technologiae (MIIT) eodem tempore online et offline habita est mense Novembri 2020 respective:
1. Online and offline synchronization of "Component Defectum Analysis Technologiae et Causae practicae" Applicationem Analysis Senior officinam.
2. electronicarum partium PCB & PCBA constantiam defectum analyseos technologiae praxis ponebat analysin online et offline synchronisationi.
3. Online and offline synchronization of environmental reliability experiment and firmity index verification and in- profundi analysis of electronic product of defect.
4. Cursus designare possumus ac institutionem internam pro inceptis disponere.
Contents Training:
1. Introductio ad analysis defectum;
2. Defectum analysis technologiarum electronicarum partium;
2.1 Basic procedendi ad defectum analysis
2.2 Basic iter analysis non perniciosa
2.3 Basic iter semi-analysis perniciosius
2.4 Basic iter analysis perniciosa
2.5 Totum processum analysis deficiendi in causa analysis
2.6 Insufficientia physicae technologiae applicabitur in rebus ex FA ad PPA et CA
3. Communia instrumenti et functionum defectum analysi;
4. Praecipua defectio modi et defectus inhaerens mechanismi componentium electronicarum;
5. Defectus analysis partium electronicarum maioris, casus classicorum defectuum materialium (defectuum chippis, defectuum crystallorum, defectuum passivationis tabulae, compages defectuum, defectuum processuum, defectuum chippis compagem, RF machinas importatas - defectiones scelerisque structuras, defectus speciales, structuram inhaerentem; defectus structurae internae, defectus materiales, resistentia, capacitas, inductio, diode, triode, MOS, IC, SCR, ambitus moduli, etc.
6. Applicationem deficiendi physicae technologiae in productum design
6.1 Insufficientia causas ex improprio ambitu design
6.2 Insufficientia causae ex improprio diuturno tradendae praesidio
6.3 Insufficientia causae per improprietas componentium
6.4 Insufficientia casus ex congruentia defectuum structurae et materiae conventus
6.5 Insufficientia causae aptabilitatis et missio- sionis de defectibus profanis
6.6 culpa casibus ex impropria matching
6.7 Insufficientia causas ex impropria tolerantia design
6.8 Mechanismus inhaerens et insita defensionis infirmitas
6.9 culpa ex componentibus parametri distribution
6.10 DELIQUIUM casus ex PCB design defectibus
6.11 Insufficientia causae ex defectibus consilio confici possunt
Post tempus: Dec-03-2020