Manufacturer competitive PCB

Sort items normalis capability specialis facultatem

comitem accumsan

Seu Rigidorum VOL-LENTO PCB 2-14 2-24
  LENTO PCB 1-10 1-12

tabula

  0,08 +/- 0.03mm 0,05 +/- 0.03mm
  Min. crassitudine    
  Max. crassitudine 6mm 8mm
  Max. magnitudine 485mm * 1000mm 485mm * 1500mm
& Slote foraminis Min.Hole 0.15mm 0.05mm
  Min.Slot Sanctus 0.6mm 0.5mm
  Rationem ratio

10:01

12:01

vestigium Min.Width / Tractus 0.05 / 0.05mm 0.025 / 0.025mm
tolerantia Vestigium W / S ± 0.03mm ± 0.02mm
    (W / S≥0.3mm: ± X%) (W / S≥0.2mm: ± X%)
  Foraminis, ut foraminis ± 0.075mm ± 0.05mm
  ratio foraminis ± 0.075mm ± 0.05mm
  IMMINENTIA 0 ≤ eae ≤ 50Ω: ± 5Ω 50Ω ≤ Value: X% ± Ω  
material Basefilm Specification Ex prima hujus: 3mil 2mil 1mil 0.8mil 0.5mil  
    A. D & C, 2oz 1oz I / 2oz I / I 3oz / 4oz  
  Main elit Basefilm Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Coverlay Specification Ex prima hujus: 2mil 1mil 0.5mil  
  Colo colui cultum LPI Viridi / Red / White / Black / White Blue / Rubrum  
  P. stiffener T: * 25um 250um  
  FR4 stiffener T: * 100um 2000um  
  Sus stiffener T: * 100um 400um  
  AL stiffener T: * 100um 1600um  
  tape 3M / Tesa / Nitto  
  Tactus opposuitque Argentum film / Magnesium / argentum atramento  
superficiem consummavi OSP 0.1 - 0.3um  
  removerit Sn: 5um - 40um  
  Removerit (Leed liber) Sn: 5um - 40um  
  ENEPIG III: 1.0 - 6.0um  
    BA: 0.015-0.10um  
    An: 0.015 - 0.10um  
  Durum aurum plating III: 1.0 - 6.0um  
    An: 0.02um - 1um  
  Flash auri III: 1.0 - 6.0um  
    An: 0.02um - 0.1um  
  enig III: 1.0 - 6.0um  
    An: 0.015um - 0.10um  
  argentum Immesion A g: 0.1 - 0.3um  
  Plating plumbum album Sn: 5um - 35um  
SMT genus 0.3mm picem Iungo  
    0.4mm picem BGA / QFP / QFN  
    CCI Component