Aliquam PCB Manufacturer

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accumsan comitem

Rigidum-flex PCB 2-14 2-24
  LENTO PCB 1-10 1-12

tabula

  0.08 +/- 0.03mm 0.05 +/- 0.03mm
  Min.Crassitudo    
  Maximilianus.Crassitudo 6mm 8mm
  Maximilianus.Magnitudo 485mm * 1000mm 485mm * 1500mm
Foraminis & Slot Min.Hole 0.15mm 0.05mm
  Min.Slot foramen 0.6mm 0.5mm
  Rationem ratio

10:01

12:01

Trace Min.Width / Space 0.05 / 0.05mm 0.025 / 0.025mm
tolerantia Vestigium W / S ± 0.03mm ± 0.02mm
    (W/S≥0.3mm:±10%) (W/S≥0.2mm:±10%)
  Foraminis ad foraminis ± 0.093mm ± 0.05mm
  Foramen Dimension ± 0.093mm ± 0.05mm
  Impedimentum 0 ≤ ≤ ≤ 50Ω: ± 5Ω 50Ω ≤ Pendo: ± 10%Ω  
Materia Basefilm Specification PI : 3mil 2mil 1mil 0.8mil 0.5mil  
    ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ  
  Baselilm Main elit Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Coverlay Specification PI : 2mil 1mil 0.5mil  
  LPI Color Viridi / Flavo / Albo / Nigro / Caeruleo / Red  
  PI Stiffener T : 25um 250um  
  FR4 Stiffener T : 100um 2000um  
  SUS Stiffener T : 100um 400um  
  AL Stiffener T : 100um 1600um  
  Tape 3M / Tesa / Nitto  
  Tactus opposuitque Argentea pellicula / Cuprum / atramentum argenteum  
Superficiem metam OSP 0.1 - 0.3um  
  HASL Sn : 5um - 40um  
  HASL (Leed gratis) Sn : 5um - 40um  
  ENEPIG Ni : 1.0 - 6.0um  
    Ba : 0.015-0.10um  
    Au : 0.015 - 0.10um  
  Durum aurum plating Ni : 1.0 - 6.0um  
    Au : 0.02um - 1um  
  Flash aurum Ni : 1.0 - 6.0um  
    Au : 0.02um - 0.1um  
  ENIG Ni : 1.0 - 6.0um  
    Au : 0.015um - 0.10um  
  Immesio argenteus Ag : 0.1 - 0.3um  
  Plating Tin Sn : 5um - 35um  
SMT Type 0.3mm picem Connectors  
    0.4mm picis BGA / QFP / QFN  
    0201 Component