Sort | items | Normalis facultatem | Facultatem specialem |
accumsan comitem | Rigidum-flex PCB | 2-14 | 2-24 |
LENTO PCB | 1-10 | 1-12 | |
tabula | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
Min.Crassitudo | |||
Maximilianus.Crassitudo | 6mm | 8mm | |
Maximilianus.Magnitudo | 485mm * 1000mm | 485mm * 1500mm | |
Foraminis & Slot | Min.Hole | 0.15mm | 0.05mm |
Min.Slot foramen | 0.6mm | 0.5mm | |
Rationem ratio | 10:01 | 12:01 | |
Trace | Min.Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm |
tolerantia | Vestigium W / S | ± 0.03mm | ± 0.02mm |
(W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
Foraminis ad foraminis | ± 0.093mm | ± 0.05mm | |
Foramen Dimension | ± 0.093mm | ± 0.05mm | |
Impedimentum | 0 ≤ ≤ ≤ 50Ω: ± 5Ω 50Ω ≤ Pendo: ± 10%Ω | ||
Materia | Basefilm Specification | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
Baselilm Main elit | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
Coverlay Specification | PI : 2mil 1mil 0.5mil | ||
LPI Color | Viridi / Flavo / Albo / Nigro / Caeruleo / Red | ||
PI Stiffener | T : 25um 250um | ||
FR4 Stiffener | T : 100um 2000um | ||
SUS Stiffener | T : 100um 400um | ||
AL Stiffener | T : 100um 1600um | ||
Tape | 3M / Tesa / Nitto | ||
Tactus opposuitque | Argentea pellicula / Cuprum / atramentum argenteum | ||
Superficiem metam | OSP | 0.1 - 0.3um | |
HASL | Sn : 5um - 40um | ||
HASL (Leed gratis) | Sn : 5um - 40um | ||
ENEPIG | Ni : 1.0 - 6.0um | ||
Ba : 0.015-0.10um | |||
Au : 0.015 - 0.10um | |||
Durum aurum plating | Ni : 1.0 - 6.0um | ||
Au : 0.02um - 1um | |||
Flash aurum | Ni : 1.0 - 6.0um | ||
Au : 0.02um - 0.1um | |||
ENIG | Ni : 1.0 - 6.0um | ||
Au : 0.015um - 0.10um | |||
Immesio argenteus | Ag : 0.1 - 0.3um | ||
Plating Tin | Sn : 5um - 35um | ||
SMT | Type | 0.3mm picem Connectors | |
0.4mm picis BGA / QFP / QFN | |||
0201 Component |